COPPER

 
 
Continuous Cast Copper Rod
 

Physical Dimensions

Size Diameter Ovality Elec. Conductivity Elongation Residual Oxide Film Oxygen, ppm Coil ID/OD Coil Weight
8 mm.

8mm + 0.38mm

+ 0.38mm

> 100% IACS

> 30%

< 1000 A o

200-550

928/1432

2.25T/1T

11 mm. 11mm + 0.38mm + 0.38mm > 100% IACS > 30% < 1000 A o < 400 928/1432 2.25T/1T
12.5 mm. 12.5mm + 0.38mm + 0.38mm > 100% IACS > 30% < 1000 A o < 350 9287/1432 2.25T/1T
16 mm. 12.5mm + 0.38mm + 0.38mm > 100% IACS > 30% < 1000 A o < 350 928/1432 2.25T/1T
 

Chemical Composition

 

Element Maxm Conc. (ppm) Group Total Maxm (ppm)
Se

2

 
Te 2  
Bi 1 3
Cr - -
Mn - -
Sb 4 -
Cd - 15
As 5 -
P - -
Pb 5 5
S 15 15
Sn    
Ni    
Fe 10 20
Si - -
Zn - -
Co - -
Ag 25 25
 

Copper Cathode

 
Physical Dimensions Length Width Thickness Weight
ICC

960mm

945-950mm 10mm 100 Kg (Approx.)
KCC 940mm 815mm 11 + 2 mm 80-90 Kg
 
Chemical Composition
Element (ppm) (ppm)
Se

0.1

<1.0
Te - -
Bi - -
Cr <0.5 <1.0
Mn - -
Sb <0.5 <0.5
Cd - -
As <0.1 <1.0
P <12 '8-12
Pb <0.5 -
S <2 '1-3
Sn <3 5.0-9.0
Ni - -
Fe <0.1 -
Si <10 <1.0
Zn 100 -
Co - -
Ag <10 5.0-7.0
Oxygen 100 <100
Cu Content 99.97% 99.98%
ASTM B-115/95 and / or Cu-CATH-1 grade of BSEN 1978-1998 equivalent to LME Grade-I.
 

Copper Wire Bar

Physical Dimensions
Length Width - at top Width - at bottom Height Weight
1372 + 41 mm

111 + 6 mm

102 + 6 mm 102 + 6 mm 108 + 5 Kg
 
Chemical Composition
Element (%)

Copper

99.90% (Min.)
Lead 0.005% (Max.)
Bismuth 0.001% (Max.)
Total impurities excluding Ag & Oxygen 0.03% (Max.)
STANDARD CONFORMING TO : (IS : 191, 1980 Part - V).
 

Sulphuric Acid

Item Purity End uses

Sulphuric Acid

98% Manufacture of Fertilizer and Alum, Drying of Gases
 

Selenium

Item Purity End uses

Selenium

99% Photoelectric devices, Glass, bangles, Insecticide, Vulcanisation of rubber
 

Copper Sulphate

Item Purity End uses

Copper Sulphate

24.5% to 24.% Electro refining of Copper for Electrolyte and Pesticides (Agriculture)
 

Palladium

Item Purity End uses

Tellurium

99% As catalyst in Automobiles, jewellery, in dentistry, non-magnetic springs in clocks, coating special mirrors, to face electrical contacts in automatic switchgear
 

Tellurium

Item Purity End uses

Tellurium

99% Surface hardening and Semiconductor
 

Dump Slag

Analysis Report of Typical Sample of Copper Granulated Dump Slag.

Composition

Fe as FeO

55% to 60%
SiO 30% to 33%
A1 O 5% - 7%
CaO 1.0% - 1.5%
MgO 0.8 % - 1.0%
CuO (0.075% - 0.08%)
Free Silica < (0.5%)
Sulphates 0.1%
 

Sieve Analysis for Bulk Grit

0.8 mm and above

4.5%
3.4 mm to 4.8mm 7.7%
1.2 mm to 3.4mm 46.3%
0.6 mm to 1.2 mm 30.6%
0.3 mm to 0.6 mm 8%
0.15 mm to 0.3 mm 2.2%
0.074 mm to 0.15 mm 0.4%
under 0.074 mm 0.3%
 

Heavy Metals

LEAD

0.02 to 0.06%
ZINC 0.06 to 0.10%
NICKEL 0.04 to 0.09%
COPPER 0.07 to 1.0%
 
Physical Properties

Hardness

5 -7 MOHS
Colour BLACK, GLOSSY
Grain Shape MULTI  FACETED
Specific Gravity at 25 o C 3.2 - 3.7
Bulk Density  at 25 o C 2.1 to 2.4 tonnes/m 3
pH 6.5
Conductivity at 25 o C Nil
Weight raise at 25 o C 1.75 - 2.0% at 900 o C
Moisture Content 0.01%
 
Top    
 
 © 2008 QUEST GLOBAL LTD. Site Map | Contact Us | Terms of Use